Foundry Competitiveness heats up in three Proportions and with novel technologies as planar scaling benefits diminish. by Ed Sperling The number of power modules with SiC components will be complemented step by step with even more parts, using either the combination of SiC diodes with silicon transistors or perhaps SiC https://www.facebook.com/permalink.php?story_fbid=pfbid02qEvHBJkYNnAjKH7oeoMT6ngHxaUsjm4aCsFYnW733Ef1uCkJBBQxCCiodGQ2CnNvl&id=61562415773754&__cft__[0]=AZUpLbxJB_sNrOWzB8NZnlU5Fo48ojrf5olu_3iIngw0xwKD3UDWiJJLGdNBAtvyqVawJeaSr10z3mb_rMHiG7smj1i1e_QDbJr6fwlbnDnC33j72fqzGqRHF5IjOPbM2h7h_MbBP8xFi0UgiyOWvT6N0hCTMZYIENbVNoZ2JqN4AGSLIVRhHud8_Qfxa3Ag7o-ghUFx5kVjjVXTTSO8fYdI&__tn__=%2CO%2CP-R